GAT562 30S Mesh Module
Product Overview
The GAT562 30S Mesh Module is a communication module designed based on the nRF52840 and SX1262. It supports Bluetooth 5.0 and LoRa Mesh, featuring powerful remote networking communication capabilities, scalability, and a low-power design.
The GAT562 30S Mesh Module is fully compatible with Meshtastic or MeshCore, allowing users to update and experience the latest features within these networks. Meshtastic (or MeshCore) is a community-driven open-source project that enables the reasonable use of LoRa radios for long-range off-grid communication in areas without existing or reliable communication infrastructure.
Key Advantages
Decentralized: Does not rely on a central server or base station. Every device can act as a relay node to forward information. There is no single point of failure in the network; even if some nodes fail, the overall communication is not affected, resulting in higher network reliability and stability.
Long-Range Communication: Utilizes wireless communication technologies like LoRa to achieve communication over several kilometers or even further. It has significant advantages in remote areas without network coverage or vast outdoor spaces.
Off-Grid Communication: Does not rely on the internet or mobile networks. It can communicate normally in places without mobile signals or Wi-Fi, meeting communication needs in special scenarios.
Low Power Consumption: Adopts low-power technologies such as Bluetooth Low Energy (BLE), consuming less battery power on hardware devices. This allows for long-term use and is suitable for portable devices, reducing the frequency and difficulty of charging.
Open Source & Customizable: The software is open source, allowing developers to freely modify and extend the code according to their needs. Secondary development can add new features or optimize existing ones to meet personalized user requirements.
Cross-Platform Compatibility: Supports a variety of hardware devices and operating systems. Users can choose devices that suit them (such as mobile phones, tablets, etc.) to access the network, facilitating communication between users on different devices.
Low Cost: Uses hardware modules that are generally low-cost open-source hardware. Compared to professional communication equipment, the cost is significantly reduced, making it easy to promote and use.
User-Friendly Interface: Designed with an intuitive and concise user interface, allowing even non-technical personnel to get started quickly. It facilitates device configuration, message sending, location sharing, and other operations.
Application Scenarios
Industrial Manufacturing: Production manufacturing, equipment O&M, data visualization, logistics/freight, inspection and diagnosis, etc.
Smart City: Infrastructure, smart buildings, environmental construction, health and elderly care, transportation.
Smart Park: Smart office, smart parking, smart hotels, security and fire protection, energy efficiency management.
Smart Retail: Smart water meters, smart electricity meters, smart gas meters, new energy.
Smart Agriculture: Smart irrigation, smart agricultural tools, smart fertilization, soil monitoring, water quality monitoring.
Wireless Alarm Systems and Security Systems.
Main Features
Frequency Support:
China: 470M-510M
Europe: 865M-872M
Americas, Asia, Australia: 902M-928M
Security: Encrypted point-to-point and mesh network communication.
Ease of Use: UART interface, supports Bluetooth connection to mobile Apps.
High Power: Maximum output power 1W (30dBm). Default output is 29.5dBm (Output power adjustable from 5~30dBm).
High Sensitivity: Receiver sensitivity up to -136dBm.
Strong Anti-Interference: Forward Error Correction (FEC) technology. Transmission distance of 5km in urban areas and over 25km in open areas.
Modulation: Supports FSK / GFSK / OOK modulation, bidirectional half-duplex communication.
Buffering: Multi-channel, dual data buffers (256 bytes each).
System Block Diagram
The following figure shows the system block diagram of the GAT562 30S Mesh Module:
Hardware Description
Pin Package Definition
Pin Definitions
NO
Name
Type
Description
1
VBUS
Input
DC 5V Power Supply Voltage
2
USB_D-
I/O
USB Data Interface
3
USB_D+
I/O
USB Data Interface
4
GND
－
Ground
5
VBAT_NRF
I/O
Battery Power Supply Voltage
6
I2C_SDA
I/O
I2C (SDA) P0.13
7
I2C_SCL
I/O
I2C (SCL) P0.14
8
GND
－
Ground
9
UART2_RX
Input
UART2 Interface P0.15
10
UART2_TX
Output
UART2 Interface P0.16
11
UART2_DE
I/O
UART DE Interface P0.17
12
NRF_RST
Input
Reset Pin
13
VDD_NRF
I/O
DC 3V3 Power Supply Voltage (Output when powered by 5V/VBAT)
14
GND
－
Ground
15
UART1_TX
Output
UART1 Interface P0.19
16
UART1_RX
Input
UART1 Interface P0.20
17
UART1_DE
I/O
UART DE Interface P0.21
18
SWDIO
I/O
SWD Debug Pin (SWDIO)
19
SWCLK
I/O
SWD Debug Pin (SWCLK)
20
VCC_5V
Input
VCC_5V Power Supply Voltage (For PA)
21
VBAT_SX
Input
DC 3V3 Power Supply Voltage
22
I2C_SDA2
I/O
I2C (SDA) P0.24
23
I2C_SCL2
I/O
I2C (SCL) P0.25
24
SW1
Output
GPIO P1.01
25
SW2
Output
GPIO P1.02
26
LED1
Output
GPIO P1.03
27
LED2
Output
GPIO P1.04
28
NFC1
Output
NFC / GPIO P0.09
29
NFC2
Output
NFC / GPIO P0.10
30
QSPI_CLK
I/O
SPI Interface / GPIO P0.03
31
QSPI_DIO3
I/O
SPI Interface / GPIO P0.02
32
QSPI_DIO1
I/O
SPI Interface / GPIO P0.29
33
P0.31/AIN7
Input
ADC Interface / GPIO P0.31
34
QSPI_DIO0
I/O
SPI Interface / GPIO P0.30
35
QSPI_DIO2
I/O
SPI Interface / GPIO P0.28
36
P0.05/AIN3
Input
ADC Interface / GPIO P0.05
37
P0.04/AIN2
Input
ADC Interface / GPIO P0.04
38
QSPI_CS
I/O
SPI CS / GPIO P0.26
39
GND
－
Ground
40
LoRa RF
Output
RF Port (For models without IPEX connector)
Package Dimensions
(Unit: mm)
Electrical Characteristics
General Characteristics
Name
Description
Model
GAT562 30S Mesh Module
Dimensions
26.5 x 28 x 3.0 mm (L x W x H)
Interfaces
UART1, UART2, GPIOs, ADC
Operating Temp
-40°C to 85°C
Storage Temp
-40°C to 85°C
Operating Conditions
Parameter
Min.
Typ.
Max.
Unit
Operating Temperature
-40
25
85
°C
BT LoRa Voltage
3.15
3.3
3.45
V
PA Operating Voltage
4.8
5.0
5.2
V
RF Characteristics
General
Frequency Range: 470M-510M / 865M-928M
Interfaces: UART1, UART2, GPIOs, ADC
Performance Data
Feature
Status
Min
Typ
Max
Unit
RF Transmission
RF Output Power
28.5
30
-
dBm
RX Sensitivity
RSSI
-130
-
-
dBm
SNR
-15
-
-
dB
Power Consumption
TX mode (30dBm)
-
490
-
mA
RX mode
-
7.2
-
mA
Sleep mode
-
7.2
-
uA
Design Reference Footprint
(Unit: mm)
Reflow Soldering Temperature Curve
Refer to IPC/JEDEC standards.
Peak Temperature: < 250°C
Cycles: Not more than 2 times.
Ramp up rate: Max 2°C/sec
Preheat: 150~200°C (60~120 sec)
Peak: 245 +0/-5°C
Time above 217°C: 40~70 sec
Ramp down rate: Max 2.5°C/sec
Last updated